Diffusion Bonding

Diffusion Bonding

Benefits of HIP Diffusion Bonding

The preferred method of joining high temperature materials is by diffusion bonding which can be accomplished with Hot Isostatic Processing. HIP can create essentially perfect diffusion bonds. In the HIPing industry of today 100% bonds are routine. The simultaneous application of heat and isostatic gas pressure combine to collapse bonds and porosity by creep mechanisms and to "heal" the material by diffusion bonding the material together. A very significant aspect of the HIP process in the marked reduction in the statistical spread or scatter.

Improved wear and corrosion layers

Creates high strength bonds

• Similar and dissimilar materials
  • Metal to metal; ceramics to metal; composites to other metals
  • Interlayers may be required
• High reliability joints

Interface

• Seamless grain structure

Mechanical properties

• Create unique micro-structures
  • Solid, powder, or both materials may be used
    • Simultaneously densify and bond to substrate
• Vastly different mechanical properties
• Approach parent material with similar materials
• Lower processing temperature
• No melting of parent metal
  • HIP @ 50-70% of M.P.
• No associated defects
  • Segregation
  • Solidification Cracking

Engineered alloys for specific environments

• Complex geometries
  • Micro composites
    • Metal or Ceramic matrix (MMC’s/CMC’s)
    • Combinations
      • Al w/ Carbon or Boron Fiber
      • Titanium w/ Carbon Fiber
      • Titanium w/ Silicon-Carbon Fiber
• Macro composites
  • Improve wear and/or corrosion resisitance
  • Increased life reduces downtime
  • Apply to less expensive substrates
    • Plastic extrusion barrels
    • Sputtering targets
    • Warheads w/ tungsten particles
    • Valve lifters

HIP pressure can be used to hold complex surfaces in perfect registry

Cladding may be thick or thin